PowerEdge XE9680
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AI and machine learning, DL training on large datasets, HPC, CRISP, and healthcare
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2 x 5th generation Intel® Xeon® Scalable processors
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32 sticks of 128 GB DDR5 (4 TB)
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122 TB hard drive
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8 NVIDIA H100, H200; 8 AMD MI300X; 8 Intel Gaudi 3
PowerEdge R760xa
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AI, machine learning, DL training and inference, HPC and rendering farm, as well as virtualization
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2 x 5th generation Intel® Xeon® Scalable processors
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32 sticks of 256 GB DDR5 (8 TB)
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122 TB hard drive
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4 个 400 W (DW);12 个 75 W (SW)
PowerEdge R570
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Virtualization, medium-density virtual machines, horizontally scalable databases, VDI, and software-defined storage.
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1 Intel® Xeon® 6 6700P/6500P/6700E processor
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16 sticks of 256 GB DDR5 (4 TB)
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491 TB
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3 个 400 W (DW);4 个 75 W (SW)
PowerEdge R6715
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Data analysis, dense virtualization, software-defined storage
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1 AMD EPYC™ 9005 processor
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24 sticks of 256 GB DDR5 (6 TB)
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1.2 PB
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3 个 75 W (SW)
PowerEdge T160
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SMB, near edge, remote office, traditional business applications, email/messaging, data analysis
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3U Tower Server
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1 Intel® Xeon® 6 6300 series processor
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4 sticks of 32 GB DDR5 (128 GB)
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63 TB
PowerEdge XR5610
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Centralized RAN, Distributed RAN, Network Edge, Retail, Military & Defense, vRAN, ORAN
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1 x 5th generation Intel® Xeon® Scalable processor
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8 sticks of 128 GB DDR5 (1 TB)
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30 TB
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2 个 75 W (SW)
NVIDIA GB300 NVL72
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Liquid Cooled Rack-Scale Solution with 72 NVIDIA B300 GPUs and 36 Grace CPUs
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72 NVIDIA B300 GPUs via NVIDIA Grace Blackwell Superchips
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36 NVIDIA Grace CPUs via NVIDIA Grace Blackwell Superchips
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Up to 21 TB HBM3e (GPU Memory), Up to 17 TB LPDDR5X (System Memory)
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up to 144 E1.S PCIe 5.0 drive bays
Liquid-Cooled Universal GPU Systems
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Direct-to-chip liquid-cooled systems for high-density AI infrastructure at scale.
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NVIDIA HGX H100/H200/B200
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Intel® Xeon® or AMD EPYC™
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Up to 32 DIMMs, 9TB
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Up to 24 Hot-swap U.2 or 2.5" NVMe/SATA drives
NVIDIA MGX™ Systems
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Modular Building Block Platform Supporting Today's and Future GPUs, CPUs, and DPUs
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Up to 4 NVIDIA PCIe GPUs including NVIDIA RTX PRO™ 6000 Blackwell Server Edition, H200 NVL, H100 NVL, and L40S
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NVIDIA GH200 Grace Hopper™ Superchip, Grace™ CPU Superchip, or Intel® Xeon®
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Up to 960GB ingegrated LPDDR5X memory (Grace Hopper or Grace CPU Superchip) or 16 DIMMs, up to 4TB DRAM (Intel)
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Up to 8 E1.S + 4 M.2 drives
超级刀片
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8U, 6U, and 4U blade server cabinets
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Up to 32 DIMM slots, with each node supporting up to 8TB DDR5-6400 memory
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Up to 8 3000-watt titanium-grade power supplies
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Up to 8 3000-watt titanium-grade open industry standard IPMI, Redfish API, and a full suite of management software including SuperCloud Composer
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Single or dual Intel® Xeon® 6 processors, with a maximum of 330 watts per node; or single AMD EPYC processor, with a maximum TDP of 280 watts
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Each node can accommodate up to 8 E3.S, 4 E1.S, or 2 U.2 2.5-inch hard drives
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Redundant 25Gb/10Gb/1Gb Ethernet switches; up to 400G/200G InfiniBand or 100G Intel Omni-Path architecture network for HPC applications
2480 High-Performance Model
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Four Kunpeng 920 processors
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32 DDR4-2933 DIMM slots
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25-bay model: Front-end configuration with 25 2.5-inch SAS/SATA hard drives. 8-bay model: Front-end configuration with 8 SAS/SATA hard drives
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2 hot-swappable 900W AC or 2000W AC or 1200W DC or 1500W DC power modules, supporting 1+1 redundancy
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Supports 100~240V AC, 240V DC, -48V DC
TaiShan 200 Pro server
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Four Kunpeng 920 processors (model: 7256F, 64 cores, 3.0GHz clock speed or model: 5255F, 48 cores, 3.0GHz clock speed)
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32 DDR4-3200 DIMM slots
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25-bay model: front-end configuration with 25 2.5-inch SAS/SATA SSD hard drives; 8-bay model: front-end configuration with 8 2.5-inch SAS/SATA SSD hard drives
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Two hot-swappable 2000W AC power modules, supporting 1+1 redundancy
Contact Information
Tel: +85268788531
Email:sales@trunklink.cn
service@trunklink.cn
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